Evaluation test service (transient thermal resistance measurement)
Comparing the heat dissipation characteristics of different materials! Introducing a case study of transient thermal resistance measurement.
Our company offers "evaluation testing services" for assessing the thermal characteristics of semiconductor-related products. We would like to introduce a case where the thermal characteristics of three types of samples (with different bonding materials) were confirmed and compared through transient thermal resistance measurements. When comparing each sample, the area where the difference in thermal resistance was most pronounced was the "bonding material" domain, confirming that the selection of bonding materials has a significant impact on thermal characteristics. 【Service Overview】 ■ Thermal characteristics of products ■ Thermal resistance and thermal capacity for each material ■ Bonding area of semiconductor devices (based on thermal resistance) *For more details, please refer to the PDF document or feel free to contact us.
- Company：佐用精機製作所
- Price：Other
